Three-Point Bend Test in Microelectronics
Microelectronic components such as integrated circuits (IC), flip chips, and other chip packages are typically brittle due to the silicon wafers. Stress exerted on the package during assembly may cause detrimental effects like cracking and fracture within the chip package. More specifically, densely populated printed circuit boards (PCBs) used in handheld devices undergo high stress concentrations, leading to damage of the components. Three-point bend tests are suitable when maximum stress concentration is needed in a fixed area, such as a specimen’s midpoint, making this the best solution when materials are homogeneous.
- Accurate alignment
- Multiple specimens with different lengths
- Testing small scaled chip packages
- Instron offers three-point bend fixtures that are designed for micro-bending applications on various die and electronic packages. The bend fixtures are designed for a variety of load capacities, specimen spans, and anvil radius requirements.
- Many of the three-point bend fixtures are designed with adjustable span lengths using a micrometer screw gauge. This allows for precise adjustments of the span length.
- Anvil size is critical to the thickness and width of the specimen used. Typically IC chips and other packages are thinner and smaller in size (0.5mm and below) however PCBs can be wider and thicker. Therefore it is important to use the right sized anvil based on specimen dimensions. Instron offers a wide range of anvil sizes from 0.25mm to 3mm.
- Bluehill® Universal software offers a wide range of calculations to estimate bending stress and maximum load which are critical results when testing PCBs and electronic packages.
The micro bend fixture is designed for 3-point flexure testing of miniature components and specimens, where the specimen is supported on two lower anvils and load is applied by a single upper anvil at the center of the specimen.
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The 2810-412 miniature 3-point bend fixture is designed for Mode II fracture toughness testing. The fixture fully complies with the requirements of SEMI standard G69-0996 ‘Test method for measurement of the adhesive strength between lead frames and molding compounds for semiconductor packages’.
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Bluehill® Software TestCam Video Recording and Playback module enables the user to record and replay the actual test event, allowing the operator to examine specific regions and points of interest for materials and components that produce distinct test curves.
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Bluehill® 3 is the newest version of Instron’s widely popular Bluehill Software, designed to meet the demands of any level of user from educators and test technicians to, quality engineers and laboratory managers. Compatible with 5900, 3300 and 5500 systems.
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5900 Universal Testing Systems are engineered for precision, built for durability, and offer the flexibility for changing requirements. They are designed with standard and optional features that increase testing efficiency and improve the testing experience for the operator. A wide range of models are available for testing capacities from < 100N up to 600kN.
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